"Reliability of Packaging Interconnect Structures"

Call for Papers-"Reliability of Packaging Interconnect Structures"

Journal: Soldering & Surface Mount Technology

Publisher: Emerald Publishing

Submission Deadline: 31 Jul 2026

Key Requirements:

• Interdisciplinary (materials/mechanical/electrical/manufacturing integration)

• 30%+ system failures from interconnects (industry bottleneck)

• Emerging architectures: 2.5D/3D ICs, chiplets, ultrafine-pitch TSVs, CPO

Overview

Interconnects = reliability bottleneck in 3D ICs/chiplets era. Electromigration, thermomechanical fatigue, material limits cause >30% system failures. Addresses high-cost failures, supply chain resilience, chiplet standards gaps (2025 Wuxi Taihu Conference). Critical for AI clusters, autonomous driving zero-defect requirements.

Key Research Themes

Electronic Packaging & Heterogeneous Integration

• 2.5D/3D IC reliability under thermal cycling

• Chiplet interface standardization failure modes

• Co-packaged optics (CPO) energy reduction (50-60%)

Interconnect Reliability

• Ultrafine-pitch TSVs electromigration

• High-frequency behavior degradation

• Flexible hybrid interconnect fatigue

Failure Analysis

• Multi-physics (thermal/electrical/mechanical) modeling

• In-situ characterization techniques

• AI-accelerated failure prediction

Submission Details

• Opens: 13 October 2025

• Closes: 31 July 2026

• Select: Special issue title from dropdown menu

Guest Editor Team

• Dr. Shuye Zhang, Harbin Institute of Technology, China (syzhang@hit.edu.cn)

• Dr. Qidong Wang, Institute of Microelectronics, China (wangqidong@ime.ac.cn)

• Dr. Bin Zhou, China Electronic Product Reliability and Environmental Testing Research Institute (zhoubin@ceprei.com)

• Prof. Yunhui Mei, Tiangong University, China (meiyunhui@tiangong.edu.cn)

Why This Issue Matters

Beyond Moore's Law era (China/US CHIPS Act). First comprehensive interconnect reliability issue bridging siloed disciplines. Translates theory to industry solutions for AI computing (Teco SuperPod), autonomous vehicles. Benchmarks CPO sustainability gains.

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