“Advanced Interconnects, Packaging Materials and Reliability in Microelectronics”

Call for Papers – Special Issue: “Advanced Interconnects, Packaging Materials and Reliability in Microelectronics”

Journal: Microelectronics International
Publisher: Emerald Publishing
Submission deadline: 01 February 2027

Overview

This special issue—published by Emerald—addresses the critical challenges posed by the increasing complexity of modern microelectronic systems, including heterogeneous integration and high-power density requirements. As device performance and lifespan depend heavily on the integrity of interconnects and packaging, this issue invites research that balances fundamental materials science with practical engineering solutions. The focus is on the advanced materials, manufacturing processes, and reliability assessments necessary to ensure structural integrity under demanding thermal, mechanical, and electrical conditions.

Key Research Themes

• Advanced Interconnection: Chip attachment technologies, sintered metal, solid-state bonding, and advanced solder materials.

• Reliability & Failure: Mechanisms of long-term degradation, interface reliability, and failure modes under combined thermal, mechanical, and electrical loading.

• Thermal Management: Packaging solutions for high-power density, extreme-temperature environments, and advanced thermal dissipation strategies.

• Advanced Substrates: Research on ceramic, organic, and flexible substrates, as well as wafer-level and wafer-scale packaging.

• Specialized Applications: MEMS packaging, sensor packaging, and emerging requirements for quantum electronics.

• Modeling & Simulation: Multiphysics modeling of packaging reliability, material behavior, and interface characterization.

Submission Details

• Submission deadline: 01 February 2027.

• Submission portal: https://mc.manuscriptcentral.com/miij

• Special Instructions: You must select the special issue title from the dropdown menu in response to “Please select the issue you are submitting to” during the submission process.

• Submission Standards: The journal invites original experimental research, numerical modeling, applied engineering studies, and industrial case studies. All manuscripts must adhere to the Microelectronics International Author Guidelines.

Guest Editor Team

• Kim S. Siow, Universiti Kebangsaan Malaysia (kimsiow@ukm.edu.my)

• Dongjin Kim, Korea Institute of Industrial Technology (dongjinkim@kitech.re.kr)

• Xu Long, Northwestern Polytechnical University (xulong@nwpu.edu.cn)

Why This Issue Matters

Modern electronics are evolving rapidly toward higher integration and performance, pushing current packaging and interconnect technologies to their physical limits. This special issue serves as a premier multidisciplinary platform to consolidate cutting-edge research, offering both the theoretical insights and the practical "know-how" required to overcome the structural and thermal bottlenecks of the next generation of semiconductors and electronic devices.

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