Advanced Interconnects, Packaging Materials and Reliability in Microelectronics

Call for Papers

Advanced Interconnects, Packaging Materials and Reliability in Microelectronics

JOURNAL NAME: Microelectronics International

PUBLISHER: Emerald Publishing

SUBMISSIONS OPEN: 1 February 2026

SUBMISSION DEADLINE: 1 February 2027

About This Special Issue

The increasing complexity of microelectronic systems — driven by heterogeneous integration, high-power density operation, and advanced semiconductor technologies — has intensified the need for reliable interconnects, packaging materials, and structural integrity. Challenges related to material behaviour, interface reliability, thermal-mechanical coupling, and long-term degradation are central to the performance and lifetime of modern electronic devices.

This special issue aims to present recent advances in materials, processes, modelling, and reliability assessment relevant to microelectronics packaging and interconnection, with a focus on both fundamental understanding and practical engineering applications. The issue aligns with the scope of Microelectronics International in providing a multidisciplinary platform covering materials, processes, design, and system-level considerations.

Scope & Theme Areas

We invite experimental, numerical, and applied submissions addressing, but not limited to, the following themes:

• Advanced Chip Attachment and Interconnection Technologies — Latest developments in chip-level interconnection methods and attachment processes

• Sintered Metal, Solder and Solid-State Bonding Materials — Material properties, processing, and performance of bonding technologies

• Microelectronic Materials and Interface Characterisation — Characterisation techniques and material behaviour at interfaces

• Reliability and Failure Mechanisms — Failure analysis under thermal, mechanical, and electrical loading conditions

• Thermo-Mechanical Behaviour — Behaviour of packaging materials and joints under thermo-mechanical stress

• High-Power and Extreme-Temperature Packaging — Packaging solutions for demanding power and temperature environments

• Thermal Management — Thermal management strategies in advanced electronic packages

• Wafer-Level and Wafer-Scale Packaging — Technologies and reliability considerations for wafer-level packaging

• Ceramic, Organic and Flexible Substrates — Substrate materials and their role in packaging performance

• MEMS and Sensor Packaging — Packaging design and reliability for MEMS and sensor applications

• Multiphysics Modelling and Simulation — Computational approaches to packaging reliability assessment

• Quantum Electronics Packaging and Reliability — Emerging packaging challenges for quantum electronic devices

• Industrial Case Studies and Manufacturing Challenges — Real-world applications and manufacturing insights

Guest Editors

Kim S Siow

Dongjin Kim

Xu Long

Key Deadlines & Dates

Submission Guidelines

How to submit: Manuscripts must be submitted via ScholarOne Manuscripts at https://mc.manuscriptcentral.com/miij strictly following the journal's author guidelines available at https://www.emeraldgrouppublishing.com/journal/mi#jlp_author_guidelines

Selection step: Authors must select the special issue title from the drop-down menu at the appropriate submission step — in response to "Please select the issue you are submitting to."

Eligibility: Submitted articles must not have been previously published, nor should they be under consideration for publication elsewhere while under review for this journal.

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